Hot-rolled, alkali-washed and polished molybdenum plate for electronics, semiconductor components, molds and vacuum-furnace parts. Thickness from 2 mm to over 10 mm, widths up to 1300 mm — custom sizes and drawings welcome.
| Thickness (mm) | Width (mm) | Length (mm) |
|---|---|---|
| 2.0 | 1300 | 4000 |
| 3.0 | 1200 | 4000 |
| 4.0 – 5.0 | 1200 | 3500 |
| 5.0 – 10.0 | 1200 | 3500 |
| > 10.0 | 1200 | 3500 |
| Grade / Purity | 99.95% |
| Surface | Alkali-washed / polished |
| Standard | GB/T 3876-2017 · ASTM B386-2011 |
| Quantity | As required |
| Packing | Moisture-proof paper + wooden / carton case |
| Atomic number | 42 |
| CAS number | 7439-98-7 |
| Atomic mass | 95.94 g/mol |
| Melting point | 2620 °C |
| Boiling point | 4639 °C |
| Density (20 °C) | 10.22 g/cm³ |
| Crystal structure | Body-centered cubic |
| Thermal expansion (20 °C) | 5.2 × 10⁻⁶ m/(m·K) |
| Thermal conductivity (20 °C) | 142 W/(m·K) |
| Specific heat (20 °C) | 0.25 J/(g·K) |
| Electrical conductivity (20 °C) | 17.9 × 10⁶ S/m |
| Resistivity (20 °C) | 0.056 (Ω·mm²)/m |
Mo powder mixed to grade.
Cold isostatic pressing.
Medium-frequency furnace.
Centrifugal alkali cleaning.
Surface polished to spec.
Plates and blanks for the electronics industry.
Component manufacturing for semiconductor devices.
Made into molds and high-temperature tooling.
Vacuum-furnace, nuclear, missile and aircraft components.
Send your thickness, width and length — or a drawing. Quotes within one business day.